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Reliability Matters

Reliability Matters

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Reliability Matters
Reliability Matters

Reliability Matters

Reliability Matters

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About Us

Reliability Matters is a podcast on the subject of reliability of circuit assemblies. Reliability "best practices" and success stories are discussed. This podcast features interviews with experts in the electronic assembly industry.All electronic production segments which effect product reliability are on the table. This includes contamination, coating, cleanliness assessment, inspection, building for harsh environments and more.

Latest Episodes

Episode 30: A Conversation About Reflow Technology with Guest David Heller

Episode 30: A Conversation About Reflow Technology with Heller Industries' CEO David Heller. David joined the family business in 1987, twenty seventy years after its founding. David shares what reflow ovens were like at the beginning stages of surface mount technology and the numerous technological changes required along the way.

59 MIN2 w ago
Comments
Episode 30: A Conversation About Reflow Technology with Guest David Heller

Episode 29: A Return Conversation with Foresite's Lead Investigator Eric Camden

Episode 29: Recorded at SMTAI in Chicago - A Return Conversation with Foresite's Lead Investigator Eric Camden. Eric discusses his experiences in field failure analysis including the failures and causes.

25 MINNOV 12
Comments
Episode 29: A Return Conversation with Foresite's Lead Investigator Eric Camden

Episode 28: Part 2 - A Conversation with IPC's Brook Sandy about IPC APEX EXPO’s Technical Program

Episode 28: Part 2 - A Conversation with IPC's Brook Sandy about IPC APEX EXPO’s Technical ProgramRegister for IPC APEX EXPO here: https://ipcapexexpo2020.ipc.org

58 MINOCT 25
Comments
Episode 28: Part 2 - A Conversation with IPC's Brook Sandy about IPC APEX EXPO’s Technical Program

Episode 27: Part 1 - A Conversation with IPC's Brook Sandy about the IPC APEX EXPO

Episode 27: Part 1 - A Conversation with IPC's Brook Sandy about the IPC APEX EXPO.Register for IPC APEX EXPO here: https://ipcapexexpo2020.ipc.org

55 MINOCT 25
Comments
Episode 27: Part 1 - A Conversation with IPC's Brook Sandy about the IPC APEX EXPO

Episode 26- An Interview with Ventec's Technology Ambassador Alun Morgan

Episode 26: My guest today is Alun Morgan, he is a Technology Ambassador at Ventec International Group.Our conversation today is all about cars, and the increased reliability expectations associated with their electrical systems. The electronics in modern vehicles provide an unpresented level of safety, not just for the driver, but for those people and objects around the vehicle. Because our cars go in and out of harsh environments, the circuit assemblies within the car are subjected to heat, humidity (and other sources of moisture), which contribute to reliability and therefore safety. We’ll discuss one of the primary failure mechanisms of circuit assemblies, an issue that can affect the operation of the safety systems within the automobile, it’s a real issue that for many is not well known. I spoke with Alun from his office in Scotland.Alun can be reached at alun.morgan@ventec-europe.com or through LinkedIn at https://www.linkedin.com/in/alun-morgan-04050a14/

62 MINOCT 22
Comments
Episode 26- An Interview with Ventec's Technology Ambassador Alun Morgan

Episode 25 - An interview with Indium's Kay Parker about SMT Printing and Being New in the Electronics Assembly Industry

Episode 25 - An interview with Indium's Kay Parker. We discuss SMT solder paste printing and Kay's experience as a new engineer in the electronics assembly industry.Kay Parker is a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, N.Y. In this role, she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company’s existing accounts and retaining new business.Kay first joined Indium Corporation as a college intern. During her internship, she worked alongside process engineers in Indium Corporation’s Metals and Compounds division. After graduating from the State University of New York Polytechnic Institute in 2018, Kay joined the company as a Technical Support Engineer.At SUNY Poly, Kay earned a bachelor’s degree in applied mathematics with a minor in engineering science. Her past accomplishments include managing the details of a National Science Foundation grant, forming and leading an award-winning competitive student robotics club, developing industrial manufacturing process technologies, and modeling the flow of blood in the human eye using mathematical equations and computer programs. Kay can be reached at kparker@indium.com.

42 MINOCT 8
Comments
Episode 25 - An interview with Indium's Kay Parker about SMT Printing and Being New in the Electronics Assembly Industry

Episode 24 - A Conversation with Teradyne's Reliability Experts Mark Levin and Jon Rodin

Episode 24 - A conversation with Teradyne's Manager of Reliability Mark Levin and Senior Software Engineering Manager Jon Bodin about reliability, DFM, and their new book "Improving Product Reliability and Software Quality: Strategies, Tools, Process and Implementation", 2nd Edition. The book is available here: https://tinyurl.com/y2f3nhav

63 MINSEP 24
Comments
Episode 24 - A Conversation with Teradyne's Reliability Experts Mark Levin and Jon Rodin

Episode 23 - A Conversation About Testing Circuit Assemblies with Datest Founder Robert Boguski Jr.

Episode 23 - A conversion with Datest Founder Robert Boguski Jr. about testing circuit assemblies. The conversation covers many types of circuit testing, ethics in testing, and how to share results with customers.

59 MINSEP 10
Comments
Episode 23 - A Conversation About Testing Circuit Assemblies with Datest Founder Robert Boguski Jr.

Episode 22 - A Conversation About Adhesion Testing with BTG Lab's Materials Scientist Elizabeth Kidd

Episode 22 - A Conversation About Adhesion Testing with BTG Lab's Elizabeth KiddOn this episode, we’ll be discussing surface adhesion. What makes a surface more adherable, what makes it less adherable, and most importantly, how can one determine a surface’s adhere-ability (is that a word?) before applying a coating.

58 MINAUG 26
Comments
Episode 22 - A Conversation About Adhesion Testing with BTG Lab's Materials Scientist Elizabeth Kidd

Episode 21- A Conversation with Manuel Schöllig - There's More to Clean than just Assemblies

A Conversation with Manuel Schöllig of Emil Otto, a German manufacturer of soldering and cleaning materials about cleaning stencils, pallets, fixtures, ovens, and assemblies. There's more to clean than just circuit assemblies. Manual reviews many non-assembly cleaning requirements. Manuel also describes a new flux type that reportedly does not rely on heat activation to remove harmful flux activators.

60 MINAUG 11
Comments
Episode 21- A Conversation with Manuel Schöllig - There's More to Clean than just Assemblies

Latest Episodes

Episode 30: A Conversation About Reflow Technology with Guest David Heller

Episode 30: A Conversation About Reflow Technology with Heller Industries' CEO David Heller. David joined the family business in 1987, twenty seventy years after its founding. David shares what reflow ovens were like at the beginning stages of surface mount technology and the numerous technological changes required along the way.

59 MIN2 w ago
Comments
Episode 30: A Conversation About Reflow Technology with Guest David Heller

Episode 29: A Return Conversation with Foresite's Lead Investigator Eric Camden

Episode 29: Recorded at SMTAI in Chicago - A Return Conversation with Foresite's Lead Investigator Eric Camden. Eric discusses his experiences in field failure analysis including the failures and causes.

25 MINNOV 12
Comments
Episode 29: A Return Conversation with Foresite's Lead Investigator Eric Camden

Episode 28: Part 2 - A Conversation with IPC's Brook Sandy about IPC APEX EXPO’s Technical Program

Episode 28: Part 2 - A Conversation with IPC's Brook Sandy about IPC APEX EXPO’s Technical ProgramRegister for IPC APEX EXPO here: https://ipcapexexpo2020.ipc.org

58 MINOCT 25
Comments
Episode 28: Part 2 - A Conversation with IPC's Brook Sandy about IPC APEX EXPO’s Technical Program

Episode 27: Part 1 - A Conversation with IPC's Brook Sandy about the IPC APEX EXPO

Episode 27: Part 1 - A Conversation with IPC's Brook Sandy about the IPC APEX EXPO.Register for IPC APEX EXPO here: https://ipcapexexpo2020.ipc.org

55 MINOCT 25
Comments
Episode 27: Part 1 - A Conversation with IPC's Brook Sandy about the IPC APEX EXPO

Episode 26- An Interview with Ventec's Technology Ambassador Alun Morgan

Episode 26: My guest today is Alun Morgan, he is a Technology Ambassador at Ventec International Group.Our conversation today is all about cars, and the increased reliability expectations associated with their electrical systems. The electronics in modern vehicles provide an unpresented level of safety, not just for the driver, but for those people and objects around the vehicle. Because our cars go in and out of harsh environments, the circuit assemblies within the car are subjected to heat, humidity (and other sources of moisture), which contribute to reliability and therefore safety. We’ll discuss one of the primary failure mechanisms of circuit assemblies, an issue that can affect the operation of the safety systems within the automobile, it’s a real issue that for many is not well known. I spoke with Alun from his office in Scotland.Alun can be reached at alun.morgan@ventec-europe.com or through LinkedIn at https://www.linkedin.com/in/alun-morgan-04050a14/

62 MINOCT 22
Comments
Episode 26- An Interview with Ventec's Technology Ambassador Alun Morgan

Episode 25 - An interview with Indium's Kay Parker about SMT Printing and Being New in the Electronics Assembly Industry

Episode 25 - An interview with Indium's Kay Parker. We discuss SMT solder paste printing and Kay's experience as a new engineer in the electronics assembly industry.Kay Parker is a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, N.Y. In this role, she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company’s existing accounts and retaining new business.Kay first joined Indium Corporation as a college intern. During her internship, she worked alongside process engineers in Indium Corporation’s Metals and Compounds division. After graduating from the State University of New York Polytechnic Institute in 2018, Kay joined the company as a Technical Support Engineer.At SUNY Poly, Kay earned a bachelor’s degree in applied mathematics with a minor in engineering science. Her past accomplishments include managing the details of a National Science Foundation grant, forming and leading an award-winning competitive student robotics club, developing industrial manufacturing process technologies, and modeling the flow of blood in the human eye using mathematical equations and computer programs. Kay can be reached at kparker@indium.com.

42 MINOCT 8
Comments
Episode 25 - An interview with Indium's Kay Parker about SMT Printing and Being New in the Electronics Assembly Industry

Episode 24 - A Conversation with Teradyne's Reliability Experts Mark Levin and Jon Rodin

Episode 24 - A conversation with Teradyne's Manager of Reliability Mark Levin and Senior Software Engineering Manager Jon Bodin about reliability, DFM, and their new book "Improving Product Reliability and Software Quality: Strategies, Tools, Process and Implementation", 2nd Edition. The book is available here: https://tinyurl.com/y2f3nhav

63 MINSEP 24
Comments
Episode 24 - A Conversation with Teradyne's Reliability Experts Mark Levin and Jon Rodin

Episode 23 - A Conversation About Testing Circuit Assemblies with Datest Founder Robert Boguski Jr.

Episode 23 - A conversion with Datest Founder Robert Boguski Jr. about testing circuit assemblies. The conversation covers many types of circuit testing, ethics in testing, and how to share results with customers.

59 MINSEP 10
Comments
Episode 23 - A Conversation About Testing Circuit Assemblies with Datest Founder Robert Boguski Jr.

Episode 22 - A Conversation About Adhesion Testing with BTG Lab's Materials Scientist Elizabeth Kidd

Episode 22 - A Conversation About Adhesion Testing with BTG Lab's Elizabeth KiddOn this episode, we’ll be discussing surface adhesion. What makes a surface more adherable, what makes it less adherable, and most importantly, how can one determine a surface’s adhere-ability (is that a word?) before applying a coating.

58 MINAUG 26
Comments
Episode 22 - A Conversation About Adhesion Testing with BTG Lab's Materials Scientist Elizabeth Kidd

Episode 21- A Conversation with Manuel Schöllig - There's More to Clean than just Assemblies

A Conversation with Manuel Schöllig of Emil Otto, a German manufacturer of soldering and cleaning materials about cleaning stencils, pallets, fixtures, ovens, and assemblies. There's more to clean than just circuit assemblies. Manual reviews many non-assembly cleaning requirements. Manuel also describes a new flux type that reportedly does not rely on heat activation to remove harmful flux activators.

60 MINAUG 11
Comments
Episode 21- A Conversation with Manuel Schöllig - There's More to Clean than just Assemblies
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